Featured New Product

RF-LoopTag®: bielomatik and NXP Cooperate on New Technologies

Wet UHF Inlays or Smart Labels with RF-LoopTag® and die cut aluminum antenna

bielomatik Leuze and NXP Semiconductors, the independent company founded by Philips, announce the development of a revolutionary new manufacturing concept for UHF tags. The RF-LoopTag ® is a chip module with a new form factor that simplifies the manufacture of UHF smart labels for label converters. The result is a new manufacturing standard for UHF inlays or UHF Smart Labels introducing the use of RFID into many new markets.

The RF-LoopTag® technology facilitates the placement of chip modules onto a secondary broadband UHF antenna due to decreased sensitivity of positioning tolerances and non-conductive adhesives in the manufacturing process of UHF inlays or UHF Smart Labels.

RFID-activated packaging materials will be streamlined through the use of RF-LoopTag ® technology due to its reliable contactless coupling method, even on hidden secondary antennas. RF-LoopTags ® are ready-made to be used as UHF near field transponders and thus will open up new opportunities for item-label tagging.

RF-LoopTag® application for the Packaging Industry with hidden UHF antenna

Click to enlarge image.

Qualified Manufacturing Process

Combined with a newly developed UHF antenna manufacturing process, based on environmentally friendly and disposable materials, the Smart Label production can be carried out completely on the high-speed T-100 and T-165 manufacturing platforms from bielomatik, the industry standard in reel-to-reel RFID converting and finishing.

The machine model TTL-165 demonstrates the new, surprisingly simple and cost-effective way to convert RF-LoopTags ® into Smart Labels at the highest possible speed. The unique and patent pending features of bielomatik's process are:

• New manufacturing process for Smart Labels
• Near field UHF solution RF-LoopTag®—ideal for item-level tagging
• Far field solution: RF-LoopTag® inlays or Smart Labels for 840-960 MHz
• Environmentally friendly solution—paper meets silicon

Visit bielomatik at www.biel-jag.com and NXP Semiconductors at www.nxp.com. Contact Max Golter of bielomatik at 815-624-8947 or max.golter@biel-jag.com.